Detailed specifications

1. Applicable PCB thickness: 1.60mm

2. Current capacity :3A /pin (within  30 degrees celsius )

3. The selection of direction and design supports multiple applications

4. The larger guiding design facilitates insertion

5. Number of cores: 04 to 100 even-numbered pins (complete range of models)

6. The reliable contact structure can make the contact more stable and reduce the impedance

7. Withstanding temperature : 270 degrees celsius

8. Connection method: straight, bent, SMT

Detailed specifications

1. 2.50mm pitch

2. Connection method: wire-to-board

3. High-performance contacts

4. Number of position : 4-100pos

5. The guiding design brings superior fit (guiding amount: ± 1.6mm)

6. The unique contact design enhances the mating performance

7. Supports a maximum current of 8A/PIN

Detailed specifications

1.3.96mm pitch, straight ,bent , SMT

2. Connection method: wire-to-board

3. High-performance contacts

4. Number of positions : 2-12pos

5. The guiding design brings superior fit (guiding amount: ± 1.6mm)

6. The unique terminal contact design enhances the mating performance

7. Supports 10A/pin

Detailed specifications

1. 3.5mm pitch 

2. Connection method: wire-to-board

3. High-performance contacts, multi-faceted contact

4. Number of positions : 2-18pos

5. The guiding design brings superior fit (guiding amount: ± 1.6mm)

6. The unique contact design enhances the mating performance

7. Supports a maximum current of 9A 

8. Applicable wire size : 16-22AWG

9. Compatible with the entire Molex Ultra-Fit 3.5mm series

Detailed specifications

1. 4.2mm pitch

2. Connection method: wire-to-board

3. High-performance contacts, multi-faceted contact

4. Number of cores : 2-24pos

5. The guiding design brings superior fit (guiding amount: ± 1.6mm)

6. The unique contact design enhances the mating performance

7. Supports a maximum current of 20A

8. Compatible with the entire series of Molex 4.2 Mini-ATX 3.0

Detailed specifications

1. 4.2mm pitch 

2. Connection method: wire-to-board

3. High-performance contacts, multi-faceted contact

4. Number of positions : 2-24pos

5. The guiding design brings superior fit (guiding amount: ± 1.6mm)

6. The unique contact design enhances the mating performance

7. Supports a maximum current of 20A

8. Compatible with the entire series of Molex 4.2 Mini-ATX 3.0

Detailed specifications

1. 4.2mm pitch

2. Connection method: wire-to-board

3. High-performance contacts, multi-faceted contact

4. Number of positions : 2-24pos

5. The guiding design brings superior fit (guiding amount: ± 1.6mm)

6. The unique contact design enhances the mating performance

7. Supports a maximum current of 20A

8. Compatible with the entire series of Molex 4.2 Mini-ATX 3.0

Detailed specifications

1. 5.7mm Pitch

2. Connection method: wire-to-board

3. High-performance contacts, multi-faceted contact

4. Number of cores : 2-12pos

5. The guiding design brings superior fit (guiding amount: ± 1.6mm)

6. The unique contact design enhances the mating performance

7. Supports a maximum current of 23A

8. Compatible with all series of molex Mega-Fit Power

Detailed specifications

1. 1.27mm Pitch 

2. Connection method: wire-to-board

3. High-performance contacts, round pin + round terminal block female combination

4. Number of cores: 4-100pos

5. The guiding design brings superior fit (guiding amount: ± 1.6mm)

6. The unique contact design enhances the mating performance

7. Supports 8 Gbps PAM4 performance

8. Equipped with shielding and top-out terminal blocks

Detailed specifications

1. 1.27mm Pitch

2. Connection way: wire to board 

3. High performance contact  

4. Number of positons : 20 30 40 pos

5. Guiding design brings superior fit (guiding amount : ±1.6 mm)

6. Unique contact design enhance mating performance 

7. Support maximum current 3A/PIN

Detailed specifications

1. Connection methods: straight , bent, SMT

2. Anti-shock frequency: 5GHZ

3. Current capacity : 30A/pin

4. 7.92mm pitch

5. Wire size : 10-16AWG

6. Number of positions : 1, 2, 3, 4, 5, 6 pos

7. Compatible with the Hirose DF22 series

Detailed specifications

1. Slender double-row IDC socket assembly with a pitch of 2.54mm

2. Double U-shaped slot ID component

3. Number of pins : 4 to 80

4. Double-ended, flat cable with socket 

5. Interchangeable wires and connectors

6. Multiple wiring options, including reverse connection and daisy chain

Detailed specifications

1. 1.27mm Pitch

2. Connection method: wire-to-board

3. High-performance contacts

4. Number of cores: 4-100pos

5. The guiding design brings superior fit (guiding amount: ± 1.6mm)

6. The unique contact design enhances the mating performance

7. Supports 8 Gbps PAM4 performance

8. Equipped with shielding and top-out terminal blocks

Detailed specifications

1. Connection methods: straight , bent, SMT

2. Anti-shock frequency: 2GHZ

3. Current capacity : 2A/pin

4. 1.27mm pitch

5. Wire size: 24-28AWG

6. Number of  positions : 4-80 pos

Detailed specifications

1. 2.54mm Pitch

2. Connection method: Horizontal and vertical

3. Pins number : 4-20pos

4. The guiding design brings superior fit (guiding amount: ± 1.6mm)

5. The unique contact design enhances the mating performance

6. Supports 8 Gbps PAM4 performance