Detailed specifications

1. 0.6mm Pitch

2. Connection method: Horizontal

3. Pin number : 74pos

4. The guiding design brings superior fit (guiding amount: ± 1.6mm)

5. The unique contact design enhances the mating performance

6. Supports 14 Gbps PAM4 performance

Detailed specifications

1. 0.8mm Pitch 

2. Connection method: Horizontal

3. Pin number : 10-200pos

4. The guiding design brings superior fit (guiding amount: ± 1.6mm)

5. The unique terminal contact design enhances the mating performance

6. Supports 14 Gbps PAM4 performance

Detailed specifications

1. 0.80 mm Pitch (0.315 inches)

2. 100-ohm differential signal wiring

3. 30 AWG dual-axis wire

4. 98-needle double-row system

5. Standard metal locking system

Detailed specifications

1. Applicable PCB thickness: 1.60mm

2. 28 Gbps PAM4 performance

3. Current capacity for  signal terminal : 1A /pin

4. The selection of direction and design supports multiple applications

5. The larger guiding design facilitates the fit

6. Number of pins : 10, 20, 30, 40, 50, 60, 70, 80, 100, 120, 140, 150, 160, 180, 200 POS

7. Compatible with the entire samtec HSEC1 series

8. Contact finish : Gold plating

9. Plastic material: LCP

10. Production cycle: 10 to 15 days

11. Packaging method: tape and reel

Detailed specifications

1. Applicable PCB thickness: 1.60mm

2. 14 Gbps PAM4 performance

3. Current capacity for signal pin : 2A /pin

4. The selection of direction and design supports multiple applications

5. The larger guiding design facilitates the fit

6. Number of pins : 06 to 200 pins can be freely selected

7. Contact finish : Gold plating

8. Plastic material: LCP

9. Production cycle: 15-20 days

10. Packaging method: tape and reel

Detailed specifications

1. Applicable PCB thickness: 1.60mm

2. Current capacity : 12A/pin (within 30 degrees Celsius)

3. The selection of direction and design supports multiple applications

4. The larger guiding design facilitates insertion

5. Number of pins : 04 to 100 even-numbered pins (complete range of models)

6. The reliable contact structure can make the contact more stable and reduce the impedance

7. Withstanding temperature: 270 degrees Celsius 

8. Connection method: Bent insertion

9. Contact finish : Gold plating

10. Plastic material: LCP

11. Production cycle: 2-3 weeks

12. Packaging method: Tray packaging

Detailed specifications

1. Applicable PCB thickness: 1.20mm

2. Current capacity : 1A/ pin (within  30 degrees celsius )

3. The selection of direction and design supports multiple applications

4. The larger guiding design facilitates insertion

5. Number of pins : 12, 14, 20 pins

6. The reliable dual-contact structure enables more stable contact and lower impedance

7. Withstanding temperature : 270 degrees celsius , Working temperature : 125 degrees celsius

8. The top choice in the sweeper industry

9. Contact finish : Gold plating

10. Plastic material: LCP

11. Production cycle: 10 to 15 days

12. Packaging method: Blister packaging

Detailed specifications

1. Applicable PCB board thicknesses :2.00 to 2.40mm

2. 4 Gbps PAM4 performance

3. Current capacity for  signal terminal : 5A/pin

4. The selection of direction and design supports multiple applications

5. The larger guiding design facilitates the fit

6. Number of pins: 6 to 200 pins, can be freely selected

7. Contact finish : Gold plating 10u

8. Plastic material: PA9T

9. Production cycle: 15-20 days

10. Packaging method: Tray packaging

Detailed specifications

1. Applicable PCB thickness: 1.60mm

2. Current capacity : 12A/pin  (within 30 degrees Celsius)

3. The selection of direction and design supports multiple applications

4. The larger guiding design facilitates insertion

5. Number of cores: 04 to 100 even-numbered pins (complete range of models)

6. The reliable contact structure can make the contact more stable and reduce the impedance

7. Withstanding temperature of plastic : 270 degrees Celsius

8. Connection method: Bent insertion

9. Contact finish : Gold plating

10. Plastic material: LCP

11. Production cycle: 2-3 weeks

12. Packaging method: Tray packaging

Detailed specifications

1. Applicable PCB board thickness: 1.60 to 2.00mm

2. 4 Gbps PAM4 performance

3. Signal pin :3A/pin

4. The selection of direction and design supports multiple applications

5. The larger guiding design facilitates the fit

6. Number of pins : 06 to 300 pins, freely selected

7. Contact finish : Gold plating

8. Plastic material: PA9T

9. Production cycle: 15-20 days

10. Packaging method: Tray packaging

Detailed specifications

1.Current capacity : 7A/pin

2. Connection methods: horizontal, vertical, side insertion

3. Power terminals combination options: 02 to 08 pins

4. The larger guiding design facilitates the fit

5. Contact finish : Gold plating 3u-15u

6. Plastic material: LCP

7. Production cycle: 10 to 15 days

8. Packaging method: tape and reel

Detailed specifications

1. Current capacity : 70A/pin * 6 groups

2. Current capacity : 30A/pin * 6 groups

3. Signal pin : 1A/pin , 1.27/2.54 mm pitch 

4. Signal terminals combination options : 2*2-2*40 pins

5. The larger guiding design facilitates the fit

6. Number of cores: 1+16........ arbitrary combination

7. The recommended thickness of the gold fingers PCB is 1.60mm

8. Connection methods: Horizontal, vertical, side insertion

9. Contact finish : Gold plating 3u-15u

10. Plastic material: LCP

11. Production cycle: 2-3 weeks

12. Packaging method: Tray packaging